E22-900MM22S SX1262 LoRa Module 868/915MHz 22dBm 7km SMD - Ebyte – Ebyte Official Store - IoT Module Manufacturer

Ebyte E22-900MM22S SX1262 LoRa module 868/915MHz ultra small size Lora SMD module

$3.99

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E22-900MM22S SX1262 LoRa module 868/915MHz ultra small size Lora SMD module [Chip solution]:SX1262 [Working frequency band]:850MHz~930MHz [Transmission power]:22dBm [Communication distance]:7km [Product size]:10*10*2.5mm [Product weight]:0.5g±0.02g [Introduction]:E22-900MM22S is based on the new generation... Read more

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Артикул: E22-900MM22SН/ДТеги: 22dBm, 7km, 850MHz~930MHz

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EBYTE product technical manual and detailed parameters download: https://www.cdebyte.com/Product-Selection

E22-900MM22S SX1262 LoRa module 868/915MHz ultra small size Lora SMD module

[Chip solution]:SX1262

[Working frequency band]:850MHz~930MHz

[Transmission power]:22dBm

[Communication distance]:7km

[Product size]:10*10*2.5mm

[Product weight]:0.5g±0.02g

[Introduction]:E22-900MM22S is based on the new generation of LoRaTM radio frequency chip SX1262 produced by Semtech in the United States as the core of the independent research and development of ultra-small volume, and is suitable for 868MHz, 915MHz chip LoRaTM wireless module.

E22-900MM22S SX1262 RF chip lora module

Manual Download

Manual
3D File E22-900MM22S(3D)
Company Proflile
Application Note
Pcb_lib E22-900MM22S

 

Mainly parameters
Description
Notes
Distance 7000m Clear and open environment, antenna gain 5dBi, antenna
height 2.5m, air speed 0.3kbps.
FIFO 256 Byte Maximum sending length
Crystal frequency
32 MHz -
Modulation method LoRa(recommend) -
Encapsulation way SMD -
Interface
1.27mm Stamp hole
Communication interface SPI   0-10Mbps
Overall dimensions 10* 10*2.5 mm -
Antenna interface Stamp hole/IPEX
The equivalent impedance is about 50 ohms
Mainl parameters Performance Notes
Min
Max
Power Supply Voltage(V) 0 3.7 Permanently burn module over 3.7V
Blocking power(dBm) - 10 At close range, the burn
probability is low
Operating temperature(°C) -40 85 -
Product net weight 0.5g士0.02g Product net weight
Main parameters Performance Notes
Min Typical Max
Power Supply Voltage(V) 1.8 3.3 3.7 ≥3.3V Can ensure the output power
communication level(V) - 3.3 - Using 5V TTL may burn out
Working temperature(°C) -40 - 85 Industrial grade design
Working frequency band(GHz) 850 868/915 930 Support ISM Frequecy
Power
consumption
Emission current(mA) - 119 - instantaneous power consumption
Receives the current(mA) - 6.8 - -
Sleep current(μA) - 2 - software shut off
Maximum transmitted powerdBm 21.4 21.5 22.3 -
Sensitivity of reception(dBm) -144 -146 -147 air rate is 0.3kbps
air rate(bps) 0.6k - 300k User programming control
0.018k
62.5k User programming control

 

Spring-New-Arrivals,FREE-TRIAL-NOW!E22-900MM22S HIGH-QUALITY INDUSTRIAL COMPONENTS

 Application

  • Wearable Health & Safety Devices: Due to its ultra-small 10x10mm footprint and 0.5g weight, the E22-900MM22S is ideal for integration into smart watches or portable fall-detection pendants. It solves the critical space constraint in wearable design while maintaining a 7km communication link for outdoor safety monitoring.

  • Smart Metering & Grid Infrastructure: The SX1262 based module provides superior anti-interference performance in urban environments. Its 22dBm output power ensures reliable data transmission from underground water meters or shielded electrical cabinets to gateways, significantly reducing the need for signal repeaters.

  • Wildlife Tracking & Research: For researchers tracking small animals, every gram counts. This module's minimal weight (0.5g) allows for the creation of lightweight GPS trackers that do not hinder animal movement. The long-range LoRa link enables data collection over vast wilderness areas without cellular coverage.

  • Industrial Wireless Sensor Networks (WSN): In automated factories, the SMD packaging and SPI interface allow for high-speed automated assembly onto sensor motherboards. The module’s 850MHz–930MHz wide frequency support enables a single hardware design to be deployed globally, simplifying inventory for multinational integrators.


FAQ

Q: How do I manage the thermal dissipation for the E22-900MM22S during continuous 22dBm transmission?

A: Given its compact 10x10mm size, heat concentration is a factor. You should design a solid ground plane on your carrier PCB and use multiple thermal vias under the module's ground pad. Since the peak emission current is approximately 119mA at 3.3V, ensuring a stable power supply and adequate copper area for heat spreading will prevent frequency drift and maintain long-term reliability.

Q: Can the E22-900MM22S be used directly with a 5V microcontroller via the SPI interface?

A: No, the communication level of this module is strictly 3.3V. The SX1262 chip's I/O pins are not 5V tolerant. Connecting it directly to a 5V MCU like an Arduino Uno will likely damage the RF chip. You must use a bidirectional logic level shifter or a resistor voltage divider on the SCK, MOSI, and NSS lines to ensure signal integrity and hardware safety.

Q: What are the specific advantages of the SX1262 chip in this module compared to older SX1276 models?

A: The SX1262 architecture in the E22-900MM22S offers a higher sensitivity of -147dBm and a significantly lower receiving current of only 6.8mA. This represents a nearly 50 percent reduction in power consumption during RX mode compared to the SX1276. Additionally, it supports a wider frequency range and improved blocking immunity, making it more robust in congested sub-GHz industrial environments.

Q: How should I design the antenna feedline on my PCB for the SMD stamp hole version?

A: To maintain the 50-ohm characteristic impedance required for the 22dBm output, you should use a coplanar waveguide or microstrip line design. The width of the trace should be calculated based on your PCB's dielectric constant and thickness. Avoid placing any ground planes or copper fills directly under the antenna trace on the top layer, and keep the RF path as short as possible to minimize insertion loss.

Q: Does the module support LoRaWAN protocol stacks?

A: The E22-900MM22S is a hardware-only transceiver module that communicates via SPI. While it does not have a built-in LoRaWAN stack in its firmware like an SoC or MCU-integrated module, it is fully compatible with open-source LoRaWAN libraries such as LMIC or LoRa-mac-node running on an external host microcontroller. This gives engineers full control over the protocol implementation and timing.

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Ebyte E22-900MM22S SX1262 LoRa module 868/915MHz ultra small size Lora SMD module

$3.99