The Ebyte ECK30-T13IA5ME8G-I Industrial Core Board is a cost-effective, low-power heterogeneous system-on-module (SoM) based on the industrial-grade Allwinner T113-i processor (dual-core Arm Cortex-A7 @ 1.2GHz, RISC-V co-processor, and HiFi4 DSP) with onboard 512MB DDR3 RAM and 8GB eMMC flash, utilizing a compact 45*35mm stamp-hole SMT connection interface to deliver rich peripheral options including dual-channel CAN 2.0, dual CVBS, MIPI DSI/LVDS display interfaces up to 1080p, and Gigabit Ethernet (RMII/RGMII), purposefully engineered to act as the rugged edge-processing core for global smart utility grids, distributed industrial HMI controllers, and real-time remote telemetry IoT gateways.
| Parameter Category | Parameter Dimension | Technical Specifications (Ebyte ECK30-T13IA5ME8G-I) |
| Core Processing unit | Processor Model | Allwinner T113-i (Industrial-grade Heterogeneous Multi-core) |
| CPU Architecture | Dual-core Arm Cortex-A7 @ 1.2 GHz + 1x RISC-V CPU | |
| DSP Coprocessor | On-chip HiFi4 DSP for advanced audio/signal processing | |
| RAM Memory | 512MB DDR3 SDRAM (16-bit wide) | |
| Flash Storage | 8GB eMMC | |
| Physical Interfaces | Form Factor & Mounting | Compact System-on-Module (SoM) with Stamp Hole SMT design |
| Physical Dimensions | 45 mm × 35 mm × 3.6 mm | |
| Pin Configuration | 79x Multiplexed GPIO expansion pins | |
| Connectivity & Network | Ethernet Interface | 1x EMAC (Supports 10/100/1000Mbps RMII/RGMII interfaces) |
| CAN Bus Support | 2x CAN channels supporting CAN 2.0A and CAN 2.0B protocols | |
| USB Interface | 1x USB DRD (OTG Host/Device) + 1x USB 2.0 HOST | |
| Serial Communication | 6x High-speed UART (Up to 4Mbps, hardware/software flow control) | |
| High-Speed Peripherals | 1x SPI (Master/Slave, up to 100MHz), 4x TWI (I2C) | |
| Multimedia & I/O | Display Output | Parallel RGB (24-bit), Dual-channel LVDS, & 4-lane MIPI DSI (Up to 1080P @ 60fps) |
| Video Input / Output | 2x CVBS In (NTSC/PAL, 10-bit ADC), 1x CVBS Out (NTSC/PAL, 10-bit DAC) | |
| Camera Interface | 1x 8-bit CSI parallel digital camera interface (Up to 1080P @ 30fps) | |
| Audio Interface | Onboard Codec: 2-ch DAC, 3-ch ADC, 3x MIC In, 1x LINE In, Headphone Out, 1x OWA | |
| ADC Interfaces | 2-ch GPADC (12-bit SAR, up to 1MHz), 4-ch TPADC (4-wire resistive touch) | |
| PWM Outputs | 8x PWM channels (0-100% duty cycle, output frequency up to 100MHz) | |
| System Reliability | Hardware Debugging | 3x Independent JTAG interfaces (Arm, RISC-V, and HiFi4 DSP) |
| Operating Temp Range | Industrial-grade: -40°C to +85°C |
| Function | quantity | Function description |
| CPU | 1 |
T113-i； Dual-core ARM Cortex-A7@1.2GHz； RISC-V CPU； HiFi4 DSP； |
| MEM | 1 |
On-board DDR3 SDRAM, 16-bit wide, 256MB/512MB/1GB optional; |
| FLASH | 1 |
On-board 8GB eMMC / On-board 256MB SPI NAND FLASH optional; |
| DISPLAY | 1 |
Parallel RGB 24-bit color output, supporting up to 1920×1080@60fps; Dual-channel LVDS output, supporting up to 1920×1080@60fps; 4-lane MIPI DSI, supporting up to 1920×1200@60fps; Note: Some of the I/Os of the above display interface are multiplexed and cannot be used at the same time; serial RGB output supports up to 800×480@60fps; |
| CSI | 1 |
8-bit parallel digital camera interface, supports 1080P@30fps, maximum 148.5MHz pixel clock; |
| CVBS IN | 2 |
1 CVBS decoder, supports NTSC and PAL formats, 10-bit video ADC; |
| CVBS OUT | 1 |
Supports NTSC and PAL formats, 10-bit video DAC; |
| Audio Codec | 1 |
2-channel DAC, sampling rate 8KHz~192KHz; 3-channel ADC, sampling rate 8KHz~48KHz; 3 MIC IN, 1 LINE IN, 1 FM IN; 1 differential LINE OUT, 1 Headphone OUT; |
| EMAC | 1 |
Support RMII/RGMII interface (10/100/1000Mbps); |
| SMHC | 2 |
Support SD3.0, SDIO3.0, MMC5.0 protocols; SDC0: 4-bit data bus (recommended as backplane Micro SD function); SDC1: 4-bit data bus; Note: SDC2 is not led to the stamp hole and is used to connect eMMC or FLASH memory chips on the board; |
| USB DRD | 1 |
Complies with USB2.0 standard and supports USB HOST and USB Device functions; |
| USB HOST | 1 |
Comply with USB2.0 standard and support USB HOS function; |
| TWI(I2C) | 4 |
Supports standard mode (100Kbps) and high-speed mode (400Kbps); |
| SPI | 1 |
Supports SPI mode and DBI (Display Bus Interface) mode; Supports Master Mode, Slave Mode, and 1 chip select signal; Supports up to 100MHz operating frequency; |
| UART | 6 |
Maximum 4Mbps baud rate (64MHz APB clock), supports hardware or software flow control; |
| PWM | 8 |
0~100% adjustable duty cycle, supports output and input capture, output frequency is 0~24MHz or 100MHz; |
| GPADC | 2 |
12-bit SAR type A/D converter with sampling frequency up to 1MHz; |
| TPADC | 4 |
12-bit SAR type A/D converter, sampling frequency up to 1MHz, supports 4-wire resistive touch screen; |
| LRADC | 1 |
6-bit A/D converter, sampling frequency up to 2KHz, supports hold keys and general keys; |
| LEDC | 1 |
Supports 1024 LED serial connections, LED data transmission rate up to 800Kbps; |
| PCM/I2S | 3 |
Support full duplex, sampling rate 8KHz~384KHz; |
| DMIC | 1 |
Supports up to 8 channels, sampling rate 8KHz~48KHz; |
| OWA | 1 |
One Wire Audio, compatible with S/PDIF protocol; |
| CIR | 2 |
Contains CIR TX and CIR RX, which can be controlled remotely through infrared; |
| CAN | 2 |
Support CAN 2.0A and CAN 2.0B protocols; |
| JTAG | 3 |
Contains ARM, RISC-V and HiFi4 DSP JTAG; |
| GPIO | 79 |
Software configures GPIO function and supports interrupt input; |
Practical Application Scenarios
Scenario 1: Industrial Human-Machine Interface (HMI) for European CNC Machinery
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Regional Industry Pain Points: European manufacturing plants deploy heavy CNC machinery in high-vibration, high-EMI (electromagnetic interference) environments. Operators need highly responsive, high-definition graphical HMI screens with integrated resistive touch panels. Standard consumer-grade processing boards degrade rapidly under constant physical stress, leading to display jitter, touch response lag, and frequent system crashes that halt entire production lines.
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Ebyte Technical Solution: The ECK30-T13IA5ME8G-I serves as the central computing engine for rugged HMI terminals. It integrates a 4-wire resistive touch controller (TPADC) alongside dual-channel LVDS and MIPI DSI interfaces that easily drive vibrant 1080p graphical interfaces. The ultra-compact 45*35mm stamp-hole SMT design eliminates the risk of physical connector dislodgement under extreme machine vibration. Operating reliably down to -40°C and up to +85°C, it ensures low-latency, continuous HMI execution with high EMI immunity.
Scenario 2: Smart Grid Distribution Automation & CAN Bus Concentrators in North America
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Regional Industry Pain Points: Power grid operators in North America require secure, edge-processing concentrators to manage decentralized substations. These controllers must interface with high-speed CAN networks monitoring solar/wind inputs, communicate with legacy industrial meters over serial RS485, run localized analytics to prevent grid overload, and securely upload status reports over Gigabit fiber or cellular connections.
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Ebyte Technical Solution: This core board delivers native hardware support for dual CAN 2.0A/B protocols alongside six high-speed UART ports. Developers can seamlessly bridge legacy Modbus-RTU sensors and modern CAN-bus grid hardware directly to the Allwinner T113-i core. The gigabit network controller (EMAC) enables instantaneous edge computing and secure data transfer back to utility servers, while the heterogeneous Arm+RISC-V architecture separates critical real-time communication tasks from standard operating system processes.
Scenario 3: Real-Time AI-Assisted Security Monitoring in Middle Eastern Oil & Gas Fields
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Regional Industry Pain Points: Telemetry equipment in Middle Eastern oil fields is exposed to blistering desert heat and hazardous atmospheric conditions. Remote oil well pads require low-power, wide-temperature edge processors capable of decoding analog video feeds from security cameras, monitoring pressure sensors, and transmitting alarm telemetry over LPWAN or cellular backhaul without crashing due to thermal overload.
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Ebyte Technical Solution: The ECK30 core board's dual CVBS analog video inputs and 8-bit parallel CSI camera interface allow it to capture and decode direct video feeds at the edge. Embedded engineers can utilize the integrated HiFi4 DSP and Cortex-A7 processors to run localized motion detection and compression algorithms. Utilizing an active power-saving architecture, this core board runs with minimal heat generation, ensuring continuous 24/7 operations in remote, uncooled metal enclosures under harsh direct-sun exposure.
