| Technical Parameter | E22-400MBL-SC | E22-400TBH-02 |
|---|---|---|
| Core MCU / Architecture | STM32F103C8T6 (ARM Cortex-M3) | Dedicated High-Power RF Base |
| Frequency Band | 400 MHz Sub-GHz ISM | 230MHz / 433MHz / 470MHz |
| Module Compatibility | Package-compatible SC series wireless modules | E22-400T37S High-Power LoRa Module |
| Communication Interface | Type-C USB & Dual-side pin headers | UART / TTL & USB Debugging Port |
| Board Dimensions | 30 x 64 mm | Compact Breadboard Compatible Layout |
| Target Application | Secondary development & SC module evaluation | Rapid prototyping & high-power link testing |
| serial number | Parameter name | Parameter value | Comment |
| 1 | Test board size | 30*64mm | - |
| 2 | Production process | Lead-free process, machine-mounted | Machine bonding ensures batch consistency and reliability |
| 3 | Antenna interface | SMA | - |
| 4 | Power supply interface | Type-C | USB to Type-C |
| 5 | working temperature | -40 ~ +85℃ | - |
| 6 | Working humidity | 10%~90% | - |
| 7 | storage temperature | -40 ~ +125℃ | - |
Practical Application Scenarios
1. Multi-Module Evaluation for OEM Wireless Sensor Networks
When developing custom IoT nodes, hardware engineering teams need to test various Sub-GHz transceivers before locking down a final PCB design. The E22-400MBL-SC evaluation kit provides a modular testbed where different package-compatible SC series wireless modules can be easily mounted onto the board as needed. Its onboard STM32F103C8T6 microcontroller and fully broken-out pin headers allow developers to run custom software examples and validate wireless telemetry characteristics instantly.
2. High-Power Link Budget Verification for Industrial Telemetry
Industrial monitoring systems deployed across expansive outdoor facilities require rigorous range testing and signal penetration analysis. The E22-400TBH-02 test board integrates the high-power E22-400T37S module to simulate extreme multi-kilometer communication links. RF engineers utilize this platform to evaluate packet error rates, adjust spreading factors, and verify communication stability against environmental obstructions before deploying full-scale commercial base stations.
3. Rapid Firmware Debugging for Embedded Hardware Startups
Embedded developers writing custom sensor firmware require streamlined serial debugging access without building custom breakout boards from scratch. Both development boards feature integrated Type-C or USB bridge interfaces that supply stable power and raw serial communication channels. Developers can flash code, monitor real-time hexadecimal logs via PC terminal software, and fine-tune transmission parameters on the fly during prototype iteration.
FAQ Section
1. What is the main difference in purpose between the E22-400MBL-SC and E22-400TBH-02 models?
The E22-400MBL-SC is built around an STM32F103C8T6 MCU and designed as an evaluation kit to mount and test various package-compatible SC series wireless modules with full secondary development support. In contrast, the E22-400TBH-02 is an entry-level platform pre-integrated with a high-power E22-400T37S module, optimized specifically for long-range high-power RF testing and breadboard prototyping.
2. Can external Sub-GHz wireless modules other than the SC series be mounted on the MBL-SC kit?
The E22-400MBL-SC is specifically engineered with pin layouts and footprints tailored for Ebyte's new generation package-compatible SC series wireless modules. Mounting non-compatible or differently pinned third-party modules may result in mismatched signal paths or potential damage to the board logic.
3. Does the Type-C interface on the MBL-SC kit support firmware flashing and power supply simultaneously?
Yes, the Type-C port supplies stable operating power to the evaluation kit while also facilitating USB-to-serial communication and firmware debugging through the onboard STM32F103C8T6 controller environment, eliminating the need for separate power wires during bench testing.
