Introduction of E22P-M30S Series Modules

Against the backdrop of the growing demand for long-range, low-power, and anti-interference communication in IoT devices, the E22P-868M30S and E22P-915M30S LoRa modules have emerged as the "communication hub" in industrial sensors, smart homes, automotive remote controls, and other fields, leveraging their Hardcore performance based on the Semtech SX1262 chip. These LoRa modules integrate a PA (Power Amplifier)/LNA (Low-Noise Amplifier) RF front-end, support global mainstream frequency bands of 868/915MHz, and deliver a maximum transmit power of 30dBm, enabling stable communication over ultra-long distances of up to 12 kilometers. They also support dual modulation modes (LoRa™ and GFSK), flexibly adapting to diverse scenario requirements.

ABOUT E22P-SC series evaluation kit

The SC series evaluation kit is designed to help users quickly evaluate Ebyte's next-generation footprint-compatible wireless modules. The MCU uses the STM32F103C8T6, with all available pins broken out to pin headers on both sides. Developers can easily connect various peripherals via jumpers based on their needs, facilitating further development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be installed on the board based on customer needs.

Performance of E22P Series LoRa Modules

Ultra-Long Communication Range and High Data Rate

The wireless modules adopt LoRa™ spread spectrum technology, supporting dense networking under SF5 spreading factor, with a communication range of up to 12 kilometers in open areas. The data rate ranges from 0.3kbps to 62.5kbps (LoRa™ mode), while GFSK mode supports high-speed transmission of 300kbps, meeting diverse needs from low-frequency data reporting to real-time video streaming.

Industrial-Grade Reliability and Low-Power Design

The E22P series LoRa modules operate within a voltage range of 3.3~5.5V (optimal transmit power guaranteed at ≥5V) and feature a sleep current as low as 3μA. With an industrial-grade temperature range of -40℃~+85℃, they ensure long-term stable operation in extreme environments. Built-in 32MHz temperature-compensated crystal oscillator and 255-byte FIFO buffer effectively reduce data transmission packet loss and improve system response speed.

Flexible Interface and Compact Package

The wireless modules adopt a 38.5×24mm stamp hole package, provide an SPI communication interface compatible with mainstream MCUs, and are equipped with EN/T/RCTRL pins to support RF switch control logic, simplifying hardware design.

Key Hardware Design Considerations 

  • Power Supply Design: A stable voltage with a 30% margin reserve is required to avoid communication interruptions caused by power fluctuations.

Typical Application Scenarios

The E22P series LoRa modules have been widely used in automotive remote keys, smart home sensors, industrial automation control, and other fields. They support reflow soldering processes (peak temperature 230-250℃), adapting to large-scale automated production. For common issues, the manufacturer provides transmission distance optimization guides, electrostatic protection solutions (ESD protection diodes), and bit error rate debugging manuals to help developers quickly resolve deployment challenges.

From desert oilfields to urban underground pipe corridors, from smart homes to intelligent transportation, the E22P-xxxM30S series industrial-grade LoRa modules are driving IoT applications to extend into more complex and harsh scenarios with their "ultra-long range, ultra-low power consumption, and ultra-high reliability" characteristics. Choosing the E22P-xxxM30S industrial-grade LoRa module means selecting a proven industrial-grade communication solution, not just a wireless communication module.

Developers are advised to prioritize testing the module in scenarios requiring long-range, low-power communication, focusing on antenna design and power supply stability. Hardware engineers can refer to the reflow soldering process parameters provided by the manufacturer to ensure production yield. Technology empowers the future, and communication knows no boundaries.