A Bluetooth SoC (System on Chip) module is a highly integrated wireless communication chip or module that integrates all the core functions required for Bluetooth technology (such as radio frequency, baseband, protocol stack, processor, etc.) into a single chip, enabling wireless connectivity and data transmission between devices. It is the core vehicle for the development of Bluetooth technology and is widely used in smartphones, smart wearables, smart homes, healthcare, and other fields.

Core Components of a Bluetooth SoC Module

1. Bluetooth Protocol Stack

This includes the physical layer (PHY), link layer (LL), protocol layers (such as GATT and L2CAP), and application layer, responsible for Bluetooth communication specifications and data processing.
It supports both Classic Bluetooth and Bluetooth Low Energy (BLE), and some chips also support multiple protocols (such as ZigBee, Thread, and ANT+).

2. Radio Frequency (RF) Module

This module is responsible for transmitting and receiving Bluetooth signals and typically includes an antenna, power amplifier (PA), and low-noise amplifier (LNA).
Some modules support long-range transmission (such as the enhanced features of BLE 5.3).

3. Digital Signal Processor (DSP)

Used for audio processing (such as voice encoding and decoding) and data encryption, improving sound quality and communication security.

4. Processor (CPU)

Usually based on the ARM architecture (such as the Cortex-M series), it is responsible for running the Bluetooth protocol stack, processing application logic, and driving peripherals.

5. Peripheral Interfaces

Includes UART, SPI, I2C, GPIO, etc., for connecting to external devices such as sensors, displays, and storage.

6. Memory

Built-in Flash and SRAM are used to store firmware and runtime data.

Features of Bluetooth SoC Modules

1. High Integration

Integrating all necessary Bluetooth communication functions (RF, baseband, processor, protocol stack) into a single chip simplifies hardware design and reduces the number of external components.

2. Low Power

Through optimized hardware and protocol stack design, ultra-low power operation is achieved (e.g., standby current can reach microamps), making it suitable for battery-powered devices such as smartwatches and health monitoring devices.

3. Small Size

The module's compact size (e.g., Nordic's nRF52810 chip measures only a few square millimeters) makes it easy to embed in small devices.

4. Multi-Protocol Support

In addition to Bluetooth, some SoCs support protocols such as Wi-Fi, ZigBee, and Thread, meeting the diverse needs of Internet of Things (IoT) devices.

5. High Performance

Integrating a high-speed processor and large memory capacity supports complex data processing and multi-device connectivity (e.g., simultaneous connection to multiple sensors or audio devices).

6. Easy Development

Providing a complete development toolchain (e.g., SDK, debug interface) and extensive documentation reduces development effort.

Advantages of Bluetooth SoC Modules

1. Simplified Design

Traditional Bluetooth solutions require multiple independent chips (such as an MCU, Bluetooth module, and RF device), while SoC modules integrate all functions, shortening development cycles.

2. Reduced Cost

High integration reduces the need for external components and lowers BOM costs.

3. Improved Performance

The integrated design reduces signal interference, optimizes power consumption, and improves communication stability.

4. Supports complex features

Such as mesh networking (Bluetooth Mesh), dual-mode communication (Classic Bluetooth + BLE), and multi-device connectivity.

The price/performance ratio of Bluetooth SoC modules varies depending on the application scenario, performance requirements, and brand differences, but the overall market trend is towards high price/performance ratio, especially with the rise of domestic chips and the continuous evolution of Bluetooth technology. Based on current market data (as of July 2025) and technology trends, the following analyzes price/performance ratio from the perspectives of cost, performance, power consumption, and other dimensions, and provides recommendations.

Typical Bluetooth SoC Chips/Modules

Ebyte's Bluetooth modules typically use SoCs from well-known third-party manufacturers, such as:

Nordic nRF series: such as the nRF52832 and nRF52840 (supporting Bluetooth Low Energy 5.0/5.1, high performance and low power consumption).
TI CC series: such as the CC2640R2F (BLE 5.0) and CC2541 (BLE 4.2).
Silicon Labs EFR32BG series: such as the EFR32BG22 (low-power Bluetooth Low Energy).
Telink TLSR series: such as the TLSR825x (a domestically produced solution with high cost-effectiveness).

E104-BT50
Chip: TLSR8253 (Telink)
Protocol: Bluetooth Low Energy 5.0
Features: Supports master-slave mode, transmission range approximately 100 meters (open space), built-in PCB antenna.
Applications: Smart home, wearable devices, remote controls.

E104-BT52
Chipset: nRF52832 (Nordic)
Protocol: BLE 5.0
Features: Supports Bluetooth Mesh, rich development resources (compatible with Nordic SDK).

Classic Bluetooth + BLE Dual-Mode Module
E104-BT54
Chipset: CC2640R2F (TI)
Protocol: BLE 5.0 + Classic Bluetooth (SPP)
Features: Suitable for audio transmission, industrial control, and other scenarios.

Long-Range Bluetooth Module
E104-BT5032A
Chipset: nRF52840 (Nordic)
Protocol: BLE 5.0 (supports long-range mode)
Transmission Distance: Up to 300 meters (in open space, requires an external antenna).

Nordic Semiconductor
nRF52810: Supports Bluetooth 5.0, low power consumption, and is suitable for small devices (such as HIDs and medical sensors). nRF5340: A dual-core design (application core + network core) supports Bluetooth 5.3 and LE Audio, making it suitable for high-performance audio devices.

PAN1070 (Junye Technology)

Supports Bluetooth LE 5.3 and 2.4G proprietary protocols, with ultra-low power consumption (5μA standby current), making it suitable for smart homes and industrial IoT.

Abluetech SiP module

Integrates a Bluetooth SoC, antenna, and crystal oscillator into a single package, resulting in a smaller footprint (for example, the STR10 SiP measures only 5.3×5.2mm), making it suitable for micro devices.

How to Choose a Bluetooth SoC Module?

1. Power Requirements

Select deep sleep current and active current based on the application scenario (e.g., medical devices require extremely low power).

2. Protocol Support

Confirm whether support for Bluetooth Low Energy, Classic Bluetooth, or multiple protocols (e.g., ZigBee + Bluetooth) is required.

3. Performance Requirements

Does the processor performance (e.g., ARM Cortex-M4/M33) and memory size (Flash/SRAM) meet your requirements?

4. Environmental Compatibility

Operating temperature range (e.g., -40°C to 85°C) and anti-interference capabilities (e.g., stability in complex electromagnetic environments) are important considerations.

5. Development Resources

Does the vendor provide a comprehensive SDK, development boards, and community support (e.g., Nordic's nRF Connect toolchain)?

Bluetooth SoC modules are a key driver of wireless communication technology. With the increasing popularity of the Internet of Things and smart devices, their market is expected to continue to grow.