EWM104-BT60 Series integrated Bluetooth module for Audio and Data Transmission

The "audio + data transmission" dual-mode design of the EWM104-BT60SP series Bluetooth audio modules effectively addresses the pain point of multiple module stacking in traditional solutions. Combining practical testing experience, this article discusses the practical value of this domestic Bluetooth module from technical details, application skills to engineering implementation issues.

Product Positioning and Core Advantages

1. Dual-Mode Integrated Design

The EWM104-BT60SP2 and EWM104-BT60SP3 modules feature Bluetooth 5.2 dual-mode parallel capability—integrating both BR/EDR audio transmission and BLE data communication within a 13*19mm stamp hole package. In actual tests, we had the module play 44.1kHz sampling rate SBC encoded audio via the A2DP protocol while transmitting sensor data via BLE GATT, with no interference between the two. This is crucial for smart devices that require voice interaction + status feedback.

2. Cost-Effectiveness of Domestic Chip Solutions

After adopting domestic SOC chips, the cost is reduced by approximately 35% compared to the TI CC2640 solution, and the delivery cycle is shortened from 12 weeks to 7 days (Ebyte has sufficient original factory inventory). Batch testing of 500 modules showed a failure rate of only 0.8%, demonstrating reliable industrial-grade quality control.

Measured Technical Parameters and Engineering Recommendations

Key Performance Indicators (with Measured Data)

Power Optimization Tips

• Sleep Strategy: Use the AT+POWER command to reduce transmit power from 8dBm to 0dBm (indoor scenarios), lowering BLE connection current from 1.5mA to 1.1mA.

• Audio Energy Saving: Send AT+PLAYPAUSE to pause the audio channel during non-playback periods, reducing power consumption by 40%.

• Power Supply Design: VBAT pin should be paralleled with 10uF + 100nF capacitors to suppress voltage fluctuations caused by interference sources like motors.

IoT Application Scenarios and Practical Cases

 Smart Home Devices

In a smart massage chair project, we used the SP3 model to achieve dual functions:

• Connect to users' phones via the HFP protocol for Bluetooth calls;

• Upload massage intensity, time, and other data to the cloud in real-time via the BLE channel. When the serial port transparent transmission rate is set to 57600bps, data latency is <100ms.

Debugging Tip: The K1 pin is connected to a physical button for play/pause. A 10K pull-up resistor should be added in hardware to avoid false triggers caused by level jitter.

Industrial Sensor Nodes

Replacing traditional 433MHz modules in a temperature and humidity monitoring system:

• In SPP transparent transmission mode, a 300-meter transmission distance covers the entire workshop, supporting over 200 nodes in a network;

• 72-hour continuous operation in a -40℃ low-temperature chamber with no packet loss, proving reliable wide-temperature design.

Pitfall Avoidance Guide: When installing inside metal control cabinets, extend the PCB antenna outside the cabinet; otherwise, signal attenuation reaches 60%.

AT Command Debugging Guide (with Common Issues)

Basic Configuration Process

• Enter AT Mode: Send "+++" via serial port (no carriage return); the module returns "AT_MODE" (automatically exits if no operation within 3 seconds).

• Set Transmission Mode: AT+TRANSMODE=2 # Switch to SPP transparent transmission mode.

• Set Baud Rate: AT+BAUD=5 # Set baud rate to 115200bps (default value).

• Save Parameters: Send AT+EXIT to restart the module; parameters are automatically written to Flash.

Typical Problem Solutions

• Cannot Enter AT Mode: Check if the serial port assistant has "Send New Line" enabled; it should be disabled.

• Frequent BLE Disconnections: Modify the broadcast name via AT+BLE_NAME to avoid duplication with other devices.

• Audio Stuttering: Ensure power supply current ≥50mA; low-quality USB cables can cause voltage to drop below 2.8V.

Note: It is recommended to restore factory settings with AT+RESTORE before mass production to avoid temporary parameters from the R&D phase affecting production testing.

Hardware Design Considerations

PCB Layout Specifications

• Clearance of 20×20mm under the antenna, avoiding ground planes and high-frequency traces;

• Microphone input circuits need a π-type filter (100Ω resistor + 10nF capacitor) to suppress background noise caused by RF interference.

 Soldering Process

Reflow soldering peak temperature should be controlled at 240±5℃ (lead-free process). Refer to Chapter 8 of the manual for the temperature curve. We once experienced a 5% drop in module RF performance due to a peak temperature of 260℃.

The EWM104-BT60SP2 and EWM104-BT60SP3 series dual-mode Bluetooth audio + data transmission integrated modules have exceeded expectations in small and medium-batch projects, especially suitable for scenarios requiring dual-mode audio + data transmission. If your project is still struggling with compatibility issues of discrete modules, this integrated solution is worth trying.