The SC series evaluation suite is designed to help users quickly evaluate the new generation package compatible wireless modules. MCU uses STM32F103C8T6, and the available pins have been drawn to both sides of the needle.

Product overview of E220-900TBH-SC/E220-900MBL-SC/E220-900TBL-SC

The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. This development test board is soldered with the lora module of the E220-900T30S series LLCC68 chip. The MCU uses the STM32F103C8T6, and the available pins have been brought out to the pin headers on both sides. Developers can easily connect a variety of peripheral devices through jumpers according to actual needs, which is convenient for developers to carry out secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be mounted on board according to customer needs. The supported modules all have pin-compatible packages and can be quickly replaced.

Developers can easily connect a variety of peripheral devices through jumpers according to the actual needs, so as to facilitate developers to carry out secondary development.
The suite provides complete examples of software applications to help customers quickly develop wireless data communication. Different types of Sub-1G wireless modules can be loaded according to customer requirements. Supported modules all have pin-compatible packages for quick replacement.