E51-470NW16S EFR32 Dual-band wireless SoC module ZigBee3.0 Self-organizing Network Module Support Wi-SUN Protocol Using OFDM Modulation Technology
[Working frequency]：470~510 MHz
[Transmit power]：16dBm
[Communication distance]： 2.5km
[Size]： 20*20 mm
[Product weight]：2g±0.1g
[Introduction]：E51-470NW16S is a long-distance, low-power transmission SoC hardware module. The module uses SiliconLabs' EFR32FG25 series chips, which can achieve wireless broadcasting up to 0.3~2.5 kilometers with minimal data loss in dense urban canyon environments. . It also supports the introduction of orthogonal frequency division multiplexing modulation technology (OFDM) into Wi-SUN Field Area Network (FAN), which can achieve high data bandwidth of up to 3.6Mbps. It enables the large-scale networks required for applications such as smart cities and smart utilities, where there can be thousands of nodes. It has small dimensions, rich interface resources, supports secondary development by users, and can be widely used in the Internet of Things industry.
| RF Parameters | Parameter value | Notes |
| Working Frequency | 470~510 MHz | — |
| Power | 16 dBm | The software is adjustable and needs to be developed by the user |
| Receiving sensitivity (GFSK) | -117. 7 dBm | 10 kbps 2GFSK signal, Af = ± 25 kHz, BER<0.1%2 |
| Receiving sensitivity (OFDM) | -116. 8 dBm | 10% packet error rate (PER) without interference, OFDM 0ption4, MCSO, header MCSO, with PL = 20 octets |
| Measured distance | 2. 5 km | Clear and open, antenna gain 3. 5dBi, antenna height 2 meters, air speed 10kbps |
| Electrical parameter | Min | Typical value | Max | Unit | Notes |
| Supply voltage | 2.0 | 5.0 | 5. 5 | V | >5. 0V The output power is guaranteed, and more than 5. 5V May damage the module. |
| Communication level | 一 | 3. 3 | 一 | V | Level switching is recommended with 5. 0V TTL |
| Emission current | - | 81 | - | mA | Instantaneous power consumption |
| Receiving current | - | 11 | - | mA | — |
| Sleep current | - | 2.6 | - | uA | EM2 Deep sleep |
| Operating temperature | -40 | 一 | 125 | ℃ | — |
| Working humidity | 10 | - | 90 | % | — |
| Storage temperature | -50 | - | 150 | ℃ | — |
| Hardware parameter | Parameter value | Notes |
| IC | EFR32FG25A121F1152IM56-B | Support OFDM, can be replaced with other models in the same series, welcome to consult |
| core | ARM Cortex®-M33 | 97.5MHz, high-performance 32-bit ARM processor with DSP instructions and floating point unit |
| FLASH | 1152 KB | Can be replaced with other models in the same series, up to 1152 KB support, welcome to consult |
| RAM | 256 KB | Can be replaced with other models in the same series, up to 256 KB support, welcome to consult |
| Crystal frequency | 39MHz/32. 768KHz | The module has been connected. Procedure |
| Size | 20 * 20 mm | — |
| Antenna Type | IPEX/Stamp Hole | The equivalent impedance is about 50Q |
| Conununica tion interface | Crystal frequencyUSB2. 0、 EUART、 SPI. EUSART、 P8M、 ADC | Users need to develop their own Settings |
| Package way | SNfD/stamp holes | The distance between the feet is 1. 27mm |
| Weight | 2. 07 ±0. 1g | — |
