The Ebyte E180-Z5812SX is an industrial-grade Zigbee 3.0 wireless transceiver module powered by the Telink TLSR8258F512ET32 SoC, integrating a 32-bit MCU @ 48 MHz, 512 KB Flash, and 64 KB RAM to deliver 12 dBm transmit power and 500 m line-of-sight range while maintaining an ultra-low 2.5 uA sleep current optimized for battery-powered mesh network node deployments.
| Zigbee Hardware Specification | Technical Parameter Value | Engineering Design Notes |
|---|---|---|
| Core SoC Solution | Telink TLSR8258F512ET32 | High-efficiency 32-bit MCU core operating up to 48 MHz frequency. |
| Wireless Protocol Standard | Zigbee 3.0 Standard Mesh | Backward compatible with older Zigbee versions, supports self-healing mesh. |
| Working Frequency Band | 2.4 GHz (2405 to 2480 MHz) | Standard global ISM band allocations with multi-channel selection. |
| RF Transmit Power | 12 dBm Max | Configurable output levels via firmware settings to optimize energy consumption. |
| Communication Distance | Up to 500 m | Line-of-sight propagation path measured in an open outdoor test field. |
| Memory Configuration | 512 KB Flash / 64 KB RAM | Ample space for complex stack compilation and multi-attribute application code. |
| Ultra-Low Sleep Current | 2.5 uA | Deep sleep state with RAM retention enabled, ideal for long-life batteries. |
| Module Package Form | SMT Stamp Hole Layout | Compact surface-mount profile optimized for automated pick-and-place assembly. |
| Antenna Interface Options | PCB Antenna / Stamp Hole Pin Out | Supports flexible localized pattern trace or customized external antenna paths. |
Technical Specifications
| Parameter | Value | Remark |
| Chip / SoC | Telink TLSR8258F512ET32 | 32-bit MCU @ 48 MHz |
| Protocol | Zigbee 3.0 | IEEE 802.15.4 |
| Frequency Range | 2405 – 2480 MHz | 2.4 GHz ISM band |
| Max TX Power | 12 dBm | TX current 24 mA @ 12 dBm |
| RX Current | 9 mA (typ.) | — |
| Sleep Current | 2.5 μA (avg.) | Periodic sleep mode |
| Air Data Rate | 250 kbps | — |
| Communication Range | Up to 500 m | LOS, 5 dBi antenna @ 5 m height; mesh routing extends range |
| Flash / RAM | 512 KB / 64 KB | — |
| Working Voltage | 1.9 – 3.6 V (typ. 3.3 V) | ≥3.3 V recommended for rated TX power |
| IO Logic Level | 3.3 V | Do NOT connect 5 V TTL directly |
| Antenna Interface | IPEX (50 Ω) | Equivalent impedance ~50 Ω |
| Module Type | SMD Stamp Hole | 1.27 mm pitch |
| Dimensions | 11.5 × 18 mm | Weight: 0.9 g |
| Operating Temperature | -40 ℃ to +85 ℃ | Industrial grade |
| Origin | Chengdu, China | EBYTE / Cdebyte |
Key Features
Zigbee 3.0 Mesh Networking
Fully compliant with Zigbee 3.0 (IEEE 802.15.4), the E180-Z5812SX supports coordinator, router, and end-device roles. Zigbee mesh routing allows multi-hop communication, effectively extending coverage beyond the 500 m LOS baseline without additional infrastructure cost.
Ultra-Low Power Design
Periodic sleep current averages just 2.5 μA, enabling multi-year battery life on AA cells. The TLSR8258 SoC's hardware sleep/wake architecture minimizes latency on wake-up, making it ideal for duty-cycled sensor nodes in smart agriculture, building automation, and asset tracking.
Compact SMD Stamp Hole Form Factor
At only 11.5 × 18 mm and 0.9 g, the stamp hole (castellated) SMD design enables reliable reflow soldering directly onto host PCBs. The 1.27 mm pitch and IPEX antenna connector (50 Ω) simplify integration into space-constrained product designs.
Resources & Downloads
Practical Application Scenarios
1. High-Density Commercial Building Automation and Smart HVAC Systems
In modern office towers, environmental parameters must be constantly gathered to adjust centralized HVAC systems dynamically. Embedded inside localized ceiling temperature sensors, motorized vent dampeners, and lighting controllers, the module leverages standard Zigbee 3.0 mesh layer routines. If line-of-sight pathways are obstructed by internal structural pillars or concrete firewalls, the module nodes act as dynamic routers, dynamically passing data packets across up to 500 m segments, creating a self-healing corporate automation web.
2. Multi-Sensor Smart Agriculture Greenhouse Telemetry Arrays
Commercial greenhouse environments require dense grids of ground sensors tracking soil moisture levels, ambient humidity, and ambient light intensities without demanding frequent battery swaps. Using this module as the low-power endpoint microcontroller node, developers capitalize on the ultra-low 2.5 uA deep sleep current profile. The sensors remain asleep for long durations and wake up on hardware timers to broadcast brief telemetry bursts back to central coordination gateways, ensuring localized lithium-ion battery configurations last for multiple years in high-moisture farm sites.
3. Residential Smart Home Security and Intrusion Detection Systems
Smart home control panels require micro-second rapid reactions from various periphery detection accessories like door window magnetic pins, passive infrared motion alerts, and smoke detectors. Integrating this compact SMT module directly inside tiny battery-operated enclosures allows hardware OEMs to deploy secure, low-latency links. The 12 dBm transmission power easily overcomes interior domestic walls, allowing peripheral sensors to transmit instant alarm flags to the central home gateway without missing packets or draining localized power packs.
FAQ Section
1. Does this module require an external host microcontroller to manage the standard Zigbee 3.0 protocol execution?
No, the module is built directly around the Telink TLSR8258F512ET32 SoC, which incorporates a high-performance 32-bit integrated MCU running at 48 MHz. With 512 KB of onboard Flash memory and 64 KB of RAM, engineers can run the entire Zigbee 3.0 network protocol stack and their proprietary application code inside a single SoC chip layer, completely eliminating the need, cost, and layout space of an external master MCU.
2. What design practices should be implemented to ensure the built-in PCB antenna delivers the maximum 500 m range?
To prevent severe RF attenuation, the area directly beneath and surrounding the module's onboard PCB trace antenna must be completely free of copper pours, trace routings, or structural metal hardware across all layers of the motherboard. For ideal omnidirectional performance, the module should be soldered at the outer edge of the system PCB, and the final commercial enclosure should use non-metallic materials like ABS or polycarbonate to prevent signal blockage.
3. How does the module handle dynamic node discovery and recovery if a routing path gets physically blocked?
The device operates on native Zigbee 3.0 routing architecture, which includes automated Ad-hoc On-demand Distance Vector (AODV) routing protocols. If a node acting as an intermediate router in an industrial facility powers down or is blocked by machinery, the surrounding network nodes automatically discover the drop in signal quality and instantly recalculate an alternative path through adjacent devices, restoring full data flow to the coordinator without human maintenance intervention.
