E07-900MBL-01 is a professional USB development evaluation kit designed for the CC1101-based E07-900M10S wireless module, featuring full pin-out headers and a plug-and-play interface for rapid Sub-1GHz RF prototyping.
| Key Specification | Details |
|---|---|
| Model Number | E07-900MBL-01 |
| Compatible Chip | TI CC1101 (E07-900M10S Module) |
| Communication Interface | USB to TTL / Full GPIO Headers |
| Onboard MCU | STM8L151G4 (Ultra-low power) |
| Dimensions | 53 * 27 mm |
| Functionality | RF Module Evaluation & Firmware Debugging |
Download Manual
Manual
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Pin Definitions
| No. | Definition |
Function Description |
| 1 | 3.3V |
3.3V Electric pin |
| 2 | 3.3V |
3.3V Electric pin |
| 3 | GND |
Floor reference ground |
| 4 | GND |
Floor reference ground |
| 5 | 3.3V |
3.3V Electric pin |
| 6 | GND |
Floor reference ground |
| 7 | REST |
MCU External reset pin |
| 8 | SWIM |
SWIM pin of MCU |
| 9 | 3.3V |
3.3V Electric pin |
| 10 | VCC |
Module power supply pin, need to be shorted with pin 9 to supply power to the module |
| 11 | PC6 |
MCU ordinary IO |
| 12 | PC5 |
MCU ordinary IO |
| 13 | PB3 |
MCU ordinary IO |
| 14 | PB2 |
MCU ordinary IO |
| 15 | PB1 |
MCU ordinary IO |
| 16 | PB0 |
MCU ordinary IO |
| 17 | M1 |
Module mode switch pin (see module product manual for details) |
| 18 | M0 |
Module mode switch pin (see module product manual for details) |
| 19 | PD1 |
MCU ordinary IO |
| 20 | PD0 |
MCU ordinary IO |
| 21 | GND |
Floor reference ground |
| 22 | GND |
Floor reference ground |
| 23 | 5V |
5V Electric pin |
| 24 | 5V |
5V Electric pin |
Application
-
Rapid Prototyping for Wireless AMR: In Automatic Meter Reading (AMR) projects, engineers use the E07-900MBL-01 to quickly validate CC1101 RF performance. By utilizing the onboard USB-to-serial interface, developers can test link margins and RSSI levels without designing a custom PCB, reducing R&D cycles for smart water and gas meters.
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Industrial Sensor Verification: For integrators deploying Sub-1GHz sensors in factories, this board allows for real-time monitoring of SPI registers. The led-out pin headers enable direct connection to logic analyzers, solving the pain point of capturing complex timing issues during high-speed RF data packet transmission.
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Educational and Firmware Research: The inclusion of the STM8L151G4 MCU makes this a complete sandbox for ultra-low power firmware development. It allows engineers to optimize low-power sleep modes down to the micro-amp level before moving to final hardware production.
FAQ
Q: How does the E07-900MBL-01 handle power domain isolation between the USB 5V and the module 3.3V requirements?
A: The board integrates a high-efficiency Low Dropout Regulator (LDO) that converts the 5V USB bus voltage into a stable 3.3V DC rail required by the CC1101 and STM8L MCU. This circuit design includes decoupling capacitors to suppress high-frequency switching noise from the USB interface, ensuring that the RF sensitivity of the attached E07-900M10S module is not degraded during laboratory testing.
Q: Can the onboard STM8L151G4 MCU be bypassed to allow an external controller to drive the RF module?
A: Yes, the MBL series design features jumper-selectable pin headers that disconnect the onboard MCU from the SPI bus. By removing these jumpers, developers can connect an external Arduino, Raspberry Pi, or industrial PLC directly to the SCK, MISO, MOSI, and CSN pins of the E07-900M10S module. This flexibility allows for direct testing of custom driver logic without hardware interference.
Q: What are the implications of the 50-ohm trace design on this development board for RF signal integrity?
A: The RF signal path from the module pads to the antenna connector on the E07-900MBL-01 is engineered as a 50-ohm coplanar waveguide. This impedance matching minimizes return loss and prevents signal reflections that could lead to phantom bit errors. For engineers, this means that the performance observed on the test board—such as harmonic suppression and transmit power—closely mirrors what can be expected in a correctly designed final application PCB.
