In the wireless connectivity landscape of the Internet of Things (IoT), Bluetooth technology, especially Bluetooth Low Energy (BLE), holds a pivotal position due to its balanced advantages in power consumption, cost, ecosystem, and ease of use. As a leading domestic wireless module supplier, Chengdu EBYTE Electronic Technology Co., Ltd. (EBYTE) offers a complete Bluetooth module product matrix covering from BLE 4.0 to BLE 5.3, from simple serial port transparent transmission to complex Mesh self-organizing networks. This article systematically sorts out EBYTE's core Bluetooth module product lines, analyzes the technical characteristics, core differences, and typical application scenarios of each series, providing clear guidance for developers in model selection.

Product Line Overview and Classification Logic

EBYTE's Bluetooth module product line is extensive but can be clearly categorized based on two dimensions: functional positioning and protocol version/chip platform.

1. Classification by Function and Development Complexity

• AT Command Transparent Transmission Modules (Plug-and-Play Type): This is EBYTE's core and most abundant product line. Modules come with pre-installed firmware, allowing users to complete parameter configuration and data transmission/reception via simple serial port AT commands, eliminating the need for any Bluetooth protocol stack development experience and significantly lowering the Bluetooth access threshold for IoT devices. Representative series: E104-BTxx series, E104-BT5xxx series, Exx104-BT09 series.

• Secondary Development SoC Modules (Hardware Platform Type): Modules only provide hardware and RF components, requiring users to perform secondary development and write applications based on the chip manufacturer's SDK. This offers maximum flexibility and customization capabilities, suitable for developers with in-depth customization needs or those who wish to integrate complex logic. Representative series: E73-2G4Mxx series, E72-2G4Mxx series.

• Bluetooth Mesh Self-Organizing Network Modules: Specifically designed for large-scale, multi-node networks, supporting the SIG Mesh standard, enabling network self-discovery, self-healing, and multi-hop routing. Suitable for scenarios such as smart lighting and building automation. Representative models: E104-BT11, E104-BT12 series.

• Audio Bluetooth Modules: Focus on high-quality wireless audio transmission, supporting protocols like A2DP and HFP, suitable for products such as Bluetooth speakers and headphones. Representative models: E104-BT30, EWM104-BT5125.

• Dual-Mode Bluetooth Modules: Support both Classic Bluetooth (SPP) and Bluetooth Low Energy (BLE), compatible with legacy devices and new low-power devices. Representative models: E104-BT40 series.

• Interface Conversion Modules: Combine Bluetooth functionality with specific industrial interfaces (such as RS485/RS232, USB), facilitating wireless transformation of traditional devices. Representative models: EWD104-BT57 (RS485/232 to BLE), EWM104-BT57U (USB to BLE).

2. Classification by Bluetooth Protocol Version and Core Chip

This is the key to understanding the performance hierarchy of modules. Generally, newer versions offer stronger functionality.

• BLE 4.0/4.2 Series: Early products that meet basic transparent transmission needs at extremely low cost. Examples include the E104-BT01 based on TI CC2541 and the E104-BT02 based on Dialog DA14580.

• BLE 5.0 Series: Mainstream mature solutions with balanced performance, power consumption, and functionality. Mostly based on Nordic nRF52 series (e.g., nRF52832, nRF52810) and TI CC2640R2F. Representative models: E104-BT5032A/B, E104-BT51A, E104-BT52 series.

• BLE 5.1/5.2/5.3 Series: New-generation high-performance solutions supporting new features such as 2M PHY, long-range mode, and extended advertising. Chip platforms are more diverse, including Silicon Labs (e.g., E104-BT53C3, E104-BT53), TI (e.g., E104-BT55SP), and Telink.

• Multi-Protocol/Combo Modules: Integrate Wi-Fi and Bluetooth, or support multiple protocols such as Bluetooth, Zigbee, and Thread. Representative models: E101-C6MN4 (Wi-Fi 6 + BLE 5.3) based on ESP32-C6, and E73-2G4M08S1E (BLE 5.1 + Mesh + Zigbee + Thread) based on nRF52833.

In-Depth Analysis of Core Series

1. E104-BTxx / BT5xx Series: The Main Force of AT Command Transparent Transmission

This is the most frequently appearing and model-rich series in EBYTE's product manuals, with a regular naming convention:

• E104-BT0x: Typically cost-sensitive basic slave modules. Examples include E104-BT06 (BLE 4.2) and E104-BT07/BT08 (BLE 5.1).

• E104-BT5x: Mainstream performance-level master-slave integrated modules. Examples include E104-BT51A (TI CC2640R2F, supporting ADC/PWM and other peripherals) and E104-BT52 series (Dialog DA14531/DA14535, ultra-low power consumption).

• E104-BT50xx: High-performance master-slave integrated modules based on Nordic nRF52 series. Examples include E104-BT5032A/B (nRF52832, BT5032B with a power of 20dBm and a distance of 500m) and E104-BT5010A (nRF52810).

• E104-BT53/55 Series: High-performance modules based on Silicon Labs/TI chips for BLE 5.2/5.3. Examples include E104-BT53C3 (automotive-grade, operating temperature -40~125°C) and E104-BT55SP (based on TI CC2340, requiring secondary development).

Common Features of This Series:

• Plug-and-Play: Pre-installed transparent transmission firmware, configurable via AT commands.

• Flexible Roles: Most support multiple modes such as master, slave, master-slave integration, and observer.

• Rich Functionality: Support iBeacon, MAC binding, Over-the-Air (OTA) configuration, low-power sleep, serial port wake-up, etc.

• Comprehensive Coverage: From extreme cost (E104-BT06) to ultra-long distance (E104-BT5032B, 500m), from basic transparent transmission to integrated sensor interfaces (ADC/PWM of E104-BT51A), everything is available.

2. E73 / E72 Series: The Hardware Cornerstone for Secondary Development

This series consists of pure hardware SoC modules, ideal for developers to conduct native product design.

• E73 Series: Mostly based on Nordic nRF52 series chips, such as E73-2G4M04S1B (nRF52832), E73-2G4M08S1C (nRF52840), and E73-2G4M08S1E (nRF52833, multi-protocol). They offer powerful performance, abundant resources (large Flash/RAM), and fully exposed peripheral interfaces, suitable for mid-to-high-end product development.

• E72 Series: Mostly based on TI CC26xx series chips, such as E72-2G4M05S1B (CC2640) and E72-2G4M05S1G (CC2642). They also provide strong RF performance and low-power characteristics.

Common Features of This Series:

• Native Development: Requires programming based on the chip manufacturer's SDK (e.g., nRF5 SDK, Zephyr, TI SimpleLink).

• High Performance Ceiling: Can fully utilize the chip's complete capabilities to achieve the most complex application logic and optimal power consumption control.

• Flexible Selection: Chip options cover from economical to flagship models, meeting different project budgets and performance requirements.

3. Bluetooth Mesh Series: Building Large-Scale Networks

E104-BT11 / BT12 are specialized Mesh modules. They follow the SIG Mesh standard, supporting up to tens of thousands of nodes in a single network, enabling mobile phones to access the network through any node proxy, and realizing broadcast or fixed-point transparent transmission within the network. Suitable for scenarios such as smart lighting and smart buildings that require collaboration among a large number of devices.

4. Audio and Dual-Mode Series: Meeting Special Scenarios

• Audio Modules (e.g., E104-BT30, EWM104-BT5125): Integrate audio codecs, support high-definition encoding such as aptX and AAC, and focus on wireless audio stream transmission.

• Dual-Mode Modules (e.g., E104-BT40): Support both BLE and Classic Bluetooth SPP, applicable to occasions requiring connection to legacy Bluetooth devices (such as old mobile phones and speakers) or audio transmission.

5. Interface and Form Factor Expansion Series

• USB Interface: EWM104-BT57U, facilitating PCs or embedded hosts to quickly add Bluetooth functionality via USB interface.

• Industrial Interfaces: EWD104-BT57, providing RS485 or RS232 to BLE conversion, serving as a "serial port Bluetooth adapter" for wireless upgrades of industrial equipment.

• Ultra-Small Size: E104-BT08 (10x10mm), EWM104-BT09SP (10x14.5mm), etc., providing solutions for wearable devices and small sensors with size constraints.

Comparison of Key Selection Factors

When selecting a specific model, the following dimensions should be comprehensively considered:

Recommended Typical Application Scenarios

• Smart Wearables/Health Devices: Sensitive to power consumption and size. Recommended: E104-BT52 series (ultra-low power consumption), E104-BT08 (ultra-small size).

• Smart Home Sensors/Switches: Require low power consumption, stable connection, and fast response. Recommended: E104-BT07/BT53 (master-slave integrated, automatic connection).

• Industrial Data Acquisition/Remote Controls: May require long range, multiple connections, or industrial interfaces. Recommended: E104-BT5032B (long range), E104-BT53 (multiple connections), EWD104-BT57 (RS485 interface).

• Bluetooth Mesh Smart Lighting: Must choose Mesh modules. Recommended: E104-BT11 or E104-BT12 series.

• Complex Smart Devices/Gateways: Require strong processing capabilities, multi-protocol support, or in-depth customization. Recommended: Secondary development module E73-2G4M08S1E (multi-protocol) or Wi-Fi+Bluetooth Combo module E101-C6MN4.

• Rapid Prototyping and Productization: Pursue the shortest development time. Select a suitable transparent transmission module from the E104-BT5x or E104-BT50xx series based on specific needs (range, role, power consumption).

EBYTE's Bluetooth module product line forms strong competitiveness with its completeness, hierarchy, and ease of use. From AT command transparent transmission modules that allow developers to "get started in ten minutes" to secondary development SoC platforms that give products their soul, and to future-oriented Mesh and Bluetooth 5.x high-performance modules, EBYTE provides corresponding solutions for almost every IoT Scene.

Choosing EBYTE Bluetooth modules means not only selecting a hardware component but also choosing a market-verified ecosystem with relatively complete documentation and community support. For developers, by clarifying the core needs of their projects (power consumption, cost, functionality, development cycle) and comparing the characteristics of the above product series, they can quickly lock in the most suitable model, thereby efficiently and reliably realizing the wireless and intelligent transformation of their products.