System-on-Chip (SoC) and System-on-Module (SPI) are two different system integration solutions, each with its own characteristics and application scenarios. The following is a detailed comparison of them:

1. Definition and core concepts

SoC (System on Chip)

Integrate the functions of the entire system (such as CPU, GPU, memory, I/O interface, etc.) on a single chip, usually manufactured using a unified process node. The goal is to achieve high integration and reduce volume and power consumption.

SPI (System in Package)

Integrate multiple independent chips (such as processors, memory, sensors, etc.) into a package module through packaging technology. Each chip may use a different process node and be interconnected through a substrate.

2. Integration and structure

SoC

Single chip integration: All functional modules are located on the same chip.

Depends on advanced processes: requires a unified process node, which may involve complex multi-core design and heterogeneous computing.

Internal interconnection: low-latency communication is achieved through an on-chip bus (such as AMBA) or an on-chip network (NoC).

SPI

Multi-chip packaging: multiple independent chips are packaged on the same substrate.

Mixed process: each component can use different process nodes, with high flexibility.

External interconnection: Depends on substrate wiring (such as flip chip, TSV technology), delay and bandwidth may be limited.

3. Design complexity

SoC

High design complexity: Need to integrate multiple IP cores, difficult to verify, long design cycle.

Depends on EDA tools: Requires complex EDA tool support, such as physical design, timing analysis, etc.

High one-time investment: extremely high tape-out cost, high cost of design modification.

SPI

Relatively simple: Based on the existing chip combination, the design focuses on package interconnection.

Fast iteration: Mature chips can be reused to shorten the development cycle.

Flexible supply chain: Depends on external suppliers, easy to upgrade or replace modules.

4. Manufacturing and cost

SoC
High manufacturing cost: advanced process (such as 5nm/3nm) is required, and tape-out costs are expensive.
Obvious scale effect: low unit cost in mass production, suitable for large-scale applications.
Yield challenge: a single chip defect may lead to overall failure.
SPI
Low manufacturing cost: using existing mature process chips, packaging cost is the main factor.
Suitable for small-batch production: low initial investment, suitable for customization or rapid market demand.
Packaging complexity: high-density interconnection technology (such as 3D stacking) is required, which may increase packaging costs.

5. Performance and power consumption

SoC
High performance: low internal interconnection latency, high bandwidth, suitable for intensive computing tasks (such as AI, graphics processing).
Low power optimization: unified power supply and clock management, high energy efficiency ratio.
SPI
Limited performance: high cross-chip communication latency, bandwidth limited by substrate design.
High power consumption: multiple chips are independently powered, and heat dissipation challenges are greater.

6. Application scenarios

SoC
Mobile devices: smartphones, tablets (such as Apple A series chips).
Embedded systems: autonomous driving, IoT terminals (requires high integration and low power consumption).
High-performance computing: data centers, AI accelerators.
SPI
Flexible combination scenarios: wearable devices, AR/VR (requires rapid customization).
Heterogeneous computing: combining CPU, FPGA, sensors (such as drones, robots).
Traditional upgrades: industrial control, automotive electronics (extending product cycles using existing chips).

7. Development trends

SoC: Evolving towards more advanced processes (2nm/1nm) and chiplet architecture, combined with heterogeneous integration.
SPI: Using 3D packaging and TSV technology to improve integration, complementing chiplets (such as TSMC SoIC).
Blurred boundaries: "hybrid solutions" may appear in the future, such as achieving efficient SoC-like integration through SPI.