The Ebyte E73 series comprises high-performance, multi-protocol BLE modules based on Nordic nRF52840 and nRF52833 SoCs, supporting Bluetooth 5.1, Mesh, Zigbee, and Thread in a compact 13x18mm SMD package for advanced IoT edge computing.
| Model | Core IC | Protocol Support | Memory (Flash/RAM) | Antenna | Tx Power |
|---|---|---|---|---|---|
| E73-2G4M08S1C | nRF52840 | BLE 5.0, Mesh, Zigbee, Thread | 1MB / 256KB | Ceramic | 8dBm |
| E73-2G4M08S1CX | nRF52840 | BLE 5.0, Mesh, Zigbee, Thread | 1MB / 256KB | IPEX | 8dBm |
| E73-2G4M08S1E | nRF52833 | BLE 5.1, Mesh, Zigbee, Thread | 512KB / 128KB | Ceramic | 8dBm |
| E73-2G4M08S1EX | nRF52833 | BLE 5.1, Mesh, Zigbee, Thread | 512KB / 128KB | IPEX | 8dBm |
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【CE Certification】E73-CE
【TELEC Certification】E73-Telec
【FCC Certification】E73-FCC
| RF Parameter | Value | Remark |
|---|---|---|
| Working frequency | 2360~2500 MHz | Default: 2.4GHz (32MHz oscillator) |
| Transmitting power | 8 dBm | About 2.5mW |
| Receiving sensitivity | -103dBm@BLE 125kbps(Long distance mode) -95dBm@BLE 1M bps |
- |
| Test distance | 120m | In open and clear air, with maximum power, 5 dBi antenna gain, height of 2m, 1M bps |
| Hardware Parameter | Value | Remark |
|---|---|---|
| IC | nRF52840-QIAAC0 / aQFN™ 73 | - |
| FLASH | 1024 KB | - |
| RAM | 256 KB | - |
| Core | ARM® Cortex™ -M4F | - |
| Size | 13.0 * 18.0 mm | - |
| Antenna type | Ceramic antenna | - |
| Communication interface | I/O | - |
| Package | SMD | - |
| Electronic parameter | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|
| Power supply | 1.7 | 3.3 | 5.5 | V | - |
| Communication level | 0.7*VDD | - | VDD | V | - |
| Transmitting current | - | 17.05 12.68 7.25 7.63 |
- | mA | TX only run current (DC/DC, 3V) P(RF)= +8 dBm TX only run current (DC/DC, 3V) P(RF)= +4 dBm TX only run current (DC/DC, 5V, REG0 out= 3.3V) P(RF)= 0 dBm TX only run current(DC/DC, 3V) P(RF)= 0 dBm |
| Receiving current | - | 7.71 8.27 |
- | mA | RX only run current (DC/DC, 3V) 1M bps / 1M bps BLE RX only run current (DC/DC, 3V) 2M bps / 2M bps BLE |
| Operating temperature | -40 | 20 | +85 | ℃ | - |
| Operating humidity | 10 | 60 | 90 | % | - |
| Storage temperature | -40 | 20 | +125 | ℃ | - |








Real Developer Implementation Case
1. Smart Home BLE Touch Control Panel
Development engineer Piotr Wilk completed the BLE Touch Panel (BLE Roundpad) project based on the EBYTE E73-2G4M08S1C module (powered by the Nordic nRF52840 / nRF52833 chip), and completely open-sourced it on the tech platform Hackster.io. This practical project successfully verified Bluetooth Low Energy (BLE 5.0) integration with I2S, SPI (32MHz), and TWI (I2C) interfaces, supported a round IPS color display, 12 WS2812B RGB LEDs, Microchip SAML10 capacitive touch controller, and Li-ion battery charging (USB-C & Qi wireless), and achieved ultra-low power consumption (~500µA standby) with dynamic touch menu control and BLE-to-MQTT Home Assistant integration. View the original test process and technical documentation.
2. Wireless Embedded IoT Controller
Development engineer parasquid completed the Wireless Embedded IoT Controller project based on the Ebyte nRF52840 module (powered by the Nordic nRF52840 chip), and completely open-sourced it on the tech platform community.element14.com. This practical project successfully verified Bluetooth Low Energy (BLE) and Nordic UART Service (NUS) protocol integration with SWD and GPIO interfaces, supported a 3V coin cell battery power supply, flexible normal/high-voltage power modes, and OpenOCD programming with Espruino JavaScript firmware, and achieved ultra-low-power wireless code upload, remote debugging, and multi-pin GPIO status control. View the original test process and technical documentation.

FAQ
Q: How does the E73 series internal DC/DC regulator impact peak current consumption compared to LDO mode?
A: When the internal DC/DC regulator is enabled for the nRF52840 core, the peak current during an 8dBm transmission at 3V VDD is reduced significantly to approximately 17mA, whereas LDO mode would maintain a higher linear current draw. This efficiency is critical for coin-cell applications where internal resistance limits high burst currents.
Q: What are the layout considerations for maintaining 50-ohm impedance matching for the IPEX variant?
A: For the E73-2G4M08S1CX and EX variants, the RF trace from the module pin to the IPEX connector is factory-tuned to 50 ohms. During PCB integration, a ground plane must be maintained directly beneath the RF keep-out area, and no high-speed digital lines should cross the RF signal path to prevent parasitic capacitance and signal distortion.
Q: Can the E73 series handle logic level translation for 5V industrial sensors?
A: No, the E73 series GPIO pins are not 5V tolerant. The maximum input voltage on any I/O pin is VDD + 0.3V, with VDD capped at 5.5V only for the VBUS pin. For standard GPIO communication with 5V industrial logic, external bidirectional level shifters or simple resistor dividers are required to prevent latch-up or permanent CMOS gate damage.

