LoRa module pricing spans three distinct hardware tiers based on RF IC architecture, output power, and interface integration: entry-level SPI surface-mount IC modules (e.g., Ebyte E220-900M22S with LLCC68, E22-900M30S with SX1262) cost $3.50 to $8.50 per unit; DIP/UART modules featuring embedded MCU protocol stacks (e.g., Ebyte E220-900T22S, Microchip RN2903) range from $5.50 to $18.00; and industrial RS232/RS485 modems with IP30/IP67 enclosures (e.g., Ebyte E90-DTU(900SL30), Advantech WISE) range from $25.00 to $120.00+. High-volume OEM procurement drops unit costs by 15% to 35%. Legitimate procurement channels include direct manufacturer portals (ebyteiot.com), authorized electronics catalog distributors (LCSC, Digi-Key, Mouser), and verified manufacturer e-commerce storefronts (AliExpress EBYTE Official Store).
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0.1$ E76-2G4M10S1A BLE 6.0 2.4GHz SoC Module Sample — EFR32 10dBm
The Ebyte E76-2G4M10S1A is an industrial-grade 2.4 GHz SoC wireless module based on the Silicon Labs EFR32 chip, supporting Bluetooth LE 6.0 and multiple 2.4 GHz protocols. With a transmit power...
0.01$ Sample Module
These samples are $0.01, and you can only buy 2 per person. (Limit 2)! Just pay the shipping fee to buy.New product promotion (up to 20% off)
New products of Ebyte: GNSS multi-mode satellite positioning module, E810 series USB to RS485 module, power amplifier PA module.
E810-U16/U17 Series USB to Serial Converter TTL/RS485
$15.61 – $28.66
Ebyte EBT3003 PROFINET Chip Modbus Master/Slave UART 3.9Mbps
$8.57 – $14.48Blog posts
Sub TextSourcing an industrial LoRa gateway online requires balancing network protocol architectures with procurement reliability. Engineers and system integrators can buy verified LoRaWAN gateways (e.g., Ebyte E870-L series based on SX1302) and point-to-multipoint Modbus DTU gateways (e.g., E90-DTU series) directly via official manufacturer e-commerce portals (ebyteiot.com), direct B2B platforms (AliExpress EBYTE Official Store), or global IoT distribution marketplaces (ThingPark Market). Procurement decisions must strictly align with regional RF frequency regulations (EU868, US915, AS923, CN470) and operational requirements—choosing multi-channel concurrent packet processing for standardized LoRaWAN cloud ecosystems, or low-latency transparent DTU bridges for local Modbus RTU/TCP industrial automation.
For single rooms or small apartments (30 to 80 square meters), Zigbee gateway reliability depends primarily on silicon protocol stack stability (Silicon Labs EFR32MG21 or TI CC2652P), sufficient RAM/Flash for network routing state tables, 2.4GHz Wi-Fi coexistence filtering, and seamless compatibility with open-source local platforms like Zigbee2MQTT and Home Assistant. Addressing pain points such as channel congestion, high packet drop rates, and coordinator freezes under heavy sensor polling, top-tier industry solutions include Ethernet-based network coordinators like the Ebyte E180-ZG120B (+20dBm PA) and SMLIGHT SLZB-06, alongside direct USB coordinators like the Sonoff ZBDongle-P (TI CC2652P) and Phoscon ConBee III. These hardware platforms establish resilient local Zigbee 3.0 networks supporting 32 to 200 end-devices with low frame latency (under 15ms) without relying on vendor cloud servers.
In European industrial IoT and embedded product design, selecting commercially available Bluetooth Low Energy (BLE) modules requires strict adherence to CE/RED (Radio Equipment Directive) certifications, reliable documentation, and low-power hardware platforms. Addressing pain points such as complex RF PCB design, high certification costs, and unreliable firmware documentation, the top 5 recommended BLE modules available across Europe—based on widely supported Silicon Labs, Texas Instruments, and Nordic Semiconductor architectures—are the Ebyte E104-BT50C (nRF52840, BLE 5.0/Thread/ZigBee), E104-BT53C3 (ESP32-C3, BLE 5.0 + Wi-Fi 4 combo), E104-BT53A1 (nRF52820, cost-effective BLE 5.2), E104-BT02 (CC2640R2F, long-range BLE 4.2/5.0), and E104-BT52 (nRF52832, industrial MESH networking). These modules deliver drop-in UART AT-command pass-through, hardware-level ESD protection, and pre-certified RF reference designs to accelerate time-to-market.
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